News & Events

Industry’s most compact particulate matter sensor powers next-gen air quality monitoring

Bosch Sensortec and PurpleAir introduce cutting-edge air quality monitor at embedded world Learn more about our particulate matter sensor

Portable air quality monitor based on ultra-compact Bosch BMV080 sensor
Real-time, localized air quality data to enhance consumer health and well-being

https://youtu.be/jIJq-S5jj-w

Jariet Technologies Inc.

JARIET Technologies introduces the MX2 64GSPS 36GHz Electra-M evaluation board

64GSPS 36GHz RF-Sampling Electra-M MX2 Evaluation Board

The MX2 supports evaluation of Electra-M ICs

REDONDO BEACH, CA, UNITED STATES, January 29, 2025 /EINPresswire.com/ -- JARIET Technologies introduces the MX2 evaluation board for the 2T2R 64GSPS Electra-MA RF-Sampling Transceiver. The latest generation MX2 daughter card supports evaluation of the Electra-MA device from 100MHz to 36GHz up to 64GSPS. The RF I/O is directly accessible so the user can customize the receive and transmit paths using external baluns and components. The card utilizes an FMC+ connector for the 30Gbps JESD204C SerDes transceivers to connect to commercially available FPGA FMC+ carrier boards. The MX2 includes the software and firmware needed to quickly begin evaluation of the Electra-M integrated circuits.

The Electra family of ICs includes three speed grades to cost-effectively support a wide range of EW, RADAR, satellite, quantum, test and communications applications. The family is offered at 64, 58 and 51.2GSPS and direct RF-sampling at maximum frequencies of 36, 22 and 12GHz respectively. Released to production in 2024, the Electra RF Transceivers are the first ICs production qualified that offer the flexibility of direct RF-sampling across this enormous frequency range and breadth of applications. Direct RF-sampling reduces the complexity of RF systems down to a single IC, eliminating the need for frequency conversion mixers, PLLs, intermediate amplifiers and extra filtering at lower frequencies. This brings the agility of true SDR (software defined radio) to many markets and frequencies.

While the MX2 supports all three of the 2-channel Electra-M variants today, a 4-channel Electra-Q device and evaluation card is expected in the summer of 2025.

Visit the Electra webpage and follow us on LinkedIn for more information about the MX2 board, the ELECTRA family of ICs and JARIET Technologies.

Hirose Electric has developed and launched the new AU1 Series.

Hirose has developed and launched the AU1 Series which leverages the internal design of Hirose Electric’s CX Series, A USB Type-C connector widely used by manufacturers in Japan and globally, to enable high speed signal transmission. Additionally, its reinforced shell and housing provide enhanced durability and meet the mechanical and environmental requirements of USCAR-2 and USCAR-30, ensuring vibration and heat resistance. The Connector Position Assurance (CPA) mechanism further enhances contact reliability, Making the AU1 Series an ideal solution for internal signal transmission in automotive applications while also improving board design flexibility.

Winbond Introduces the New Automotive-qualified W77T Secure Flash Memory

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today unveils the TrustME® W77T Secure Flash family, specifically designed for the automotive industry. This ISO26262 ASIL-D Ready, ISO21434 Certified, UNECE WP.29 and TISAX compliant Secure Flash is tailored to meet the demands of emerging automotive applications, such as software-defined vehicles (SDVs) and E/E systems, providing advanced protection for connected and autonomous vehicles.

Operating at a 200MHz Double Transfer Rate (DTR) on the industry-standard Octal/xSPI interface, the W77T delivers a read bandwidth of up to 400MB/s, making it ideal for automotive System-on-Chip (SoC) designs that require fast boot times and high-performance processing capabilities. Available in a range of densities from 64Mb to 1Gb, the W77T is offered in TFBGA (Octal SPI), SOIC (Quad SPI) and WSON (Quad SPI) packages. It also features extended Replay Protected Monotonic Counters (RPMC) with 8 counters for PC based implementation. Other advanced capabilities include JEDEC SPI CRC, JEDEC xSPI compatible interface, ECC, and is manufactured in our security certified fabrication facility to ensure a secure supply chain.

As part of Winbond's TrustME® Secure Flash family, the W77T offers robust security features, including Post-Quantum Cryptography (PQC) capabilities for the security engine, NIST 800-193 compliant firmware resiliency, LMS-OTS (NIST-800-208) based remote attestation for secure supply chain, Common Criteria, ISO21434, FIPS 140-3 certification and ISO26262 Functional Safety requirements, ensuring vehicle safety, performance, and integrity.

Winbond’s W77T Secure Flash is backward compatible with the popular W25Q NOR Flash and W77Q Secure Flash family and comes equipped with an arsenal of features designed to ensure Automotive security:

Lattice Nexus 2 Named 2025 Environment + Energy Leader Award Winner

HILLSBORO, Ore. – Apr. 1, 2025 – Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced its Lattice Nexus™ 2 small FPGA platform was named ‘Top Product of the Year’ by the 2025 Environment + Energy Leader Awards for its leadership power efficiency, performance, and small form factor.

“At Lattice, sustainability is built into our mission and is pivotal to our robust FPGA portfolio of industry-leading low power, small form factor devices that help our customers achieve both their innovation and sustainability goals,” said Dan Mansur, Corporate Vice President, Product Marketing, Lattice Semiconductor. “We are honored to receive this recognition for our new Lattice Nexus 2 platform and our continued commitment to sustainability across all parts of our business.”

Sarah Roberts, Co-President of E+E Leader said, "The winners of this year’s E+E Leader Awards are tackling some of the most pressing sustainability and energy challenges with real-world, scalable solutions. This product pushes industry standards forward and is setting new benchmarks for innovation and impact.”